As of September 26, reports have emerged that South Korea’s semiconductor giant, SK Hynix, witnessed a significant surge in its stock prices, with an increase exceeding 9% after the market openedThis upward trend followed the company's announcement of successfully developing and launching the world’s first next-generation High Bandwidth Memory (HBM), dubbed HBM3E, which is already in mass production.

In a market environment characterized by a persistent growth in AI demand, HBM chips are positioned as the answer to the rapid advancements in this field, offering marked improvements in data processing speed and efficiency.

By leading the way in the mass production of high-bandwidth memory chips, SK Hynix is undoubtedly aligning itself with current market trends and user needs.

In addition, it’s noteworthy that SK Hynix's stock performance has outshone that of its main rival, Samsung Electronics, the world’s largest memory chip manufacturer, which saw a stock increase of 4% on the same day.

In recent official statements, SK Hynix outlined the successful development and launch of its latest generation HBM product, HBM3E.

One notable feature of this new chip is its impressive stacking of 12 layers, significantly enhancing its capacity by 50% when compared to the widely used 8-layer HBM chips. As a result, this chip is capable of storing and processing a greater volume of data, thereby addressing the ever-increasing demands of high-performance computing.

SK Hynix has maintained a close cooperative relationship with Nvidia, being one of the primary suppliers of HBM chips to the tech giant.

This partnership not only highlights SK Hynix’s leading position within the HBM technology domain but also opens extensive market opportunities for its products.

SK Hynix has announced plans to supply the new HBM3E chips to several unidentified customers by the end of this year.

This indicates that SK Hynix is actively expanding its market share in the HBM chip sector, aiming to meet the increasing demand from customers for high-performance, high-capacity memory solutions.

For GPU manufacturers such as Nvidia, high-performance HBM chips are pivotal in enhancing the capabilities of GPU products and satisfying the needs of the AI market.

The competition in the supply of HBM chips is heating up.

Major chip manufacturers are striving to develop more advanced and high-performance HBM products to compete for market share and meet customer demands.

As one of the leaders in HBM technology, SK Hynix’s launch of the HBM3E chip will undoubtedly intensify competition in this sector.

In July, Samsung Electronics announced plans to provide customers with mass-produced 12-layer HBM3E memory units in the latter half of the year.